Sr. Staff Electrical Engineer, High Speed Design
- Serve as the technical authority and hardware architect for a cross-functional engineering team developing a next-generation light electric vehicle product line.
- Architect and design custom complex embedded system.. Own the component selection (including high-performance MCUs, ICs, power converter controllers), schematic capture, and drive complex HDI PCB layouts.
- Drive the simulation, analysis, and validation of High-Speed signal integrity and power integrity. Design optimal PCB stack-ups and power delivery networks to support high-performance computing..
- Lead system-level EMI/EMC mitigation strategies. Design hardware that inherently passes regulatory standards on the first pass and lead complex debugging efforts if emissions issues arise.
- Drive the entire module development lifecycle, establishing best practices for both the design and validation phases of the V-model development process.
- Partner with Systems, FW, Mechanical, Thermal and Test engineers to ensure high reliability and seamless system integration, robust physical packaging of high-density boards, optimal thermal management, and comprehensive testability for mass production.
- Lead root cause analysis, complex debugging, and failure analysis of critical vehicle electrical systems and high-speed subsystems.
- Drive technical relationships with PCB fabricators, silicon vendors, and contract manufacturers (CMs) to evaluate cutting-edge components, ensure HDI DFM/DFA, and qualify advanced manufacturing processes.
- Act as a force multiplier for the hardware team. Mentor junior and mid-level engineers, drive technical design reviews, and foster engineering efficiency across the organization.
- B.S. in Electrical Engineering required; M.S. or Ph.D. with a focus on high-speed design or electromagnetics is highly preferred.
- 10+ years of electrical engineering experience with a proven track record of architectural leadership, technical excellence, and successful delivery of complex hardware products.
- Extensive experience designing high-density PCBs, including deep knowledge of microvias, blind/buried vias, precise impedance control, and advanced stack-up design.
- Proven experience routing and validating high-speed interfaces (PCIe, USB 3.x, MIPI, Automotive Ethernet etc.). Strong expertise with advanced simulation and modeling tools (e.g., HyperLynx, SIwave, HFSS, or equivalent).
- Demonstrated experience evaluating, selecting, and integrating high-performance MCUs tailored for computationally heavy embedded systems.
- Strong track record of designing for electromagnetic compatibility, understanding grounding strategies, shielding, and noise mitigation in densely packed designs.
- Deep experience implementing and troubleshooting standard communication protocols (CAN-FD, Automotive Ethernet, SPI, I²C, SENT, LIN etc.).
- Experience designing highly efficient power architectures, resolving PDN challenges, and understanding the trade-offs in complex switch-mode power supply (SMPS) topologies.
- Advanced handson skills in an electrical engineering lab environment using high-bandwidth oscilloscopes, VNAs, TDRs, and spectrum analyzers.
- Demonstrated success bringing complex, high-density products from concept through mass production, including deep collaboration with CMs on advanced sourcing and validation.
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