Design Integration Engineer

Design Integration Engineer Location Milpitas, CA :

FLSA STATUS: EXEMPT

REPORTS TO: SR. MANAGER, DESIGN INTEGRATION

SUMMARY: Under the direction of the Sr. Manager of Design Integration, the Design Integration Engineer is responsible for the mask design and layout of thin film recording heads, including tracking wafer schedules, providing mask design requirements for new or existing wafers, and managing the communication between fab expeditors and design integration to minimize wafer holds.

ESSENTIAL FUNCTIONS:

• Designs and delivers masks and layouts for thin film recording heads
• Tracks wafer schedules, mask manufacturing progress in the fab, and vendor interactions to ensure just-in-time delivery of masks, tools, or wafers
• Updates, creates, and maintains CAD libraries for layouts as needed
• Integrates new recording head designs into the existing design libraries based upon job or customer specifications
• Maintains, updates, and documents all design reference materials; ensures readiness of manufacturing materials as needed
• Reviews and analyzes data, creates reports, and presents findings to groups, teams, or departments as required
• Uses knowledge of TMR, PMR, MAMR or HAMR design integration issues, layouts, and wafer processing to ensure masks are designed efficiently and cost effectively
• Interacts with and responds to inquiries from other product groups regarding manufacturing-related issues and product or device modifications or requirements
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*

Job Requirements:

MINIMUM QUALIFICATIONS:

• Bachelor's degree in Electrical or Mechanical Engineering and/or equivalent relevant experience; Master's degree preferred
• One to three years of hands' on experience working in the thin film recording head or semiconductor industry in a mask design role
• Experience using CAD software such as DW-2000 or AutoCAD
• Proficient in the use of Microsoft Office Applications

Knowledge, Skills, and Abilities:

• Knowledge of thin film recording head manufacturing or semiconductor processes, practices, and techniques
• Knowledge and ability to use CAD or similar software to create complex masks and layouts for use in thin film recording heads
• Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
• Ability to manage and track wafer schedules, projects, and design changes efficiently to ensure just-in-time delivery of materials or wafers
• Ability to create various reports, presentations, and written sample analysis
• Ability to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, vendors, and management
• Ability to work productively and collaboratively with all levels of employees and management
• Ability to comply with all safety policies and procedures
• Demonstrated organizational and time management skills
• Demonstrated problem-solving and trouble shooting skills
• Flexible and able to prioritize

The annual base salary for this full-time position is between $96,655.20-$142,140.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS: The Design Integration Engineer works primarily in an indoor environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Spends a majority of time in a seated position, but occasionally stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 or more pounds.

• Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the or posting.

TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.

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Job Snapshot

Employee Type

Full-Time

Location

Milpitas, CA (Onsite)

Job Type

Engineering

Experience

Not Specified

Date Posted

02/28/2024