Module Engineering Program Manager

About us:

Aeva’s mission is to bring the next wave of perception to a broad range of applications from automated driving to industrial robotics, consumer electronics, consumer health, security, and beyond. Aeva is transforming autonomy with its groundbreaking sensing and perception technology that integrates all key LiDAR components onto a silicon photonics chip in a compact module. Aeva 4D LiDAR sensors uniquely detect instant velocity in addition to 3D position, allowing autonomous devices like vehicles and robots to make more intelligent and safe decisions.

Role Overview:

We are looking for an Engineering Program Manager - Module, who has experience leading complex, technical development efforts including management of build/test activity and vendor relationships to deliver high-quality products on time. The candidate will need to have a strong understanding of high-volume manufacturing process flows with an ability to coordinate the release and delivery of products to ensure company milestones stay on schedule.

What You’ll Be Doing:

• Work with photonics and packaging project teams to drive design, validation, process development, and production activities
• Oversee development of fixtures and testers to support design and manufacturing activities
• Drive closure on technical issues and development roadblocks to ensure projects meet top-level requirements and are delivered on time
• Develop/manage project schedules and effectively communicate program risks/status regularly to key stakeholders
• Serve as program interface for development activities with key suppliers

What You Have:

• Experience leading photonics, semiconductor laser diode, and/or transceiver development projects from design to production
• Demonstrated experience with semiconductor development workflows specific to silicon photonics tapeouts, wafer test, and module development
• Familiarity with photonic, and III-V fabrication processes and technologies
• Strong facilitation skills to lead efficient design requirements, status, and review meetings
• Good understanding of photonics module packaging development, including active alignment, flip chip, wire-bonding, etc
• Good understanding of validation and production test flows from wafer to module
• Excellent communication and presentation skills
• Experience shipping complex projects within an aggressive timeline
• Experience with efficient organization of work across the organization through scrum and agile framework
• Ability to rapidly adapt and work independently in a fast-moving startup environment
• Experience with automotive supply chain (preferred, but not required)
• Experience with Atlassian tools (\"e.g. Confluence, JIRA\") and Smartsheets to manage development efforts (preferred, but not required)

What's in it for you:

• Be part of a fast paced and dynamic team
• Very competitive compensation and meaningful stock grants
• Exceptional benefits: Medical, Dental, Vision, and more
• Unlimited PTO: We care about results, not punching timecards

$132,400 - $179,200 a year

Salary pay ranges are determined by role, level, and location. Within the range, the successful candidate’s starting base pay will be determined based on factors including job-related skills, experience, certifications, qualifications, relevant education or training, and market conditions. These ranges are subject to change in the future.

Depending on the position offered, equity, bonus, and other forms of compensation may be provided as part of a total compensation package, in addition to comprehensive medical, dental, and vision coverage, pre-tax commuter and health care/dependent care accounts, 401k plan, life and disability benefits, flexible time off, paid parental leave, and 11 paid holidays annually.