Senior Product Manager Advanced Packaging

Own market strategy: Analyze market data to identify trends and opportunities; develop strategic direction from insights; create compelling market analysis presentations for executive and field teams. Define product strategy: Translate voice-of-customer and competitive intelligence into market requirements, product positioning, pricing, and use cases. Build GTM excellence: Drive product messaging and value differentiation, develop competitive scorecards, and equip field teams with tools for successful launches and adoption. Partner across the business: Work with Product Management, Engineering, Manufacturing, and Sales to influence roadmap priorities and accelerate product readiness and revenue. Set pricing strategy: Establish pricing and packaging to protect market leadership, enhance margins, and expand TAM. Lead cross-functional programs: Guide project teams to key milestones and objectives in a matrix environment; contribute to functional strategy and process improvements. Lead market requirements and product strategy for assigned product(s)/line(s). Develop business and marketing plans to drive competitive advantage, revenue, and market share. Assess market penetration, positioning, pricing, and packaging to optimize growth. Partner with Engineering and Manufacturing to guide new product development and enhance existing offerings. Create field enablement content (value props, competitive battlecards, ROI/TCO models, playbooks). Deliver executive-ready market analyses and recommendations. Serve as a trusted expert internally; anticipate internal/external challenges and recommend process and product improvements. Industry depth: Familiar with Advanced Packaging trends (e.g., 2.5D/3D-IC, FOWLP, fan-out/fan-in, advanced substrates, hybrid bonding). Hands-on background: 10+ years in back-end packaging or front-end fab processes; inspection/metrology experience is a strong plus. Technical acumen: Solid understanding of the physics and operating principles of semiconductor equipment in exposure, metrology, and inspection. Customer-facing strength: Independence in customer communication, problem-solving, product messaging, and value-based differentiation. Competitive excellence: Proven in use case development and building competitive scorecards. Cross-functional collaboration: Successful track record working in a matrixed organization with Engineering, Sales, PM, and MarCom. Required MS or PhD in Engineering, Physics, Materials Science, or related discipline. 10+ years in semiconductor manufacturing or packaging; direct exposure to BEOL/FEOL processes. Demonstrated expertise in Advanced Packaging ecosystems and customer workflows. Strong analytical and communication skills; adept at executive storytelling and data-driven decisions. Experience leading cross-functional projects to milestones in a matrix environment. Hands-on inspection/metrology background. Experience with pricing strategy, product launches, and field enablement. Familiarity with reliability, yield, and metrology/inspection data as it relates to packaging performance.