Principal Optoelectronic Packaging Architect (2.5D/3D)
A global manufacturer of electronic interconnect solutions is seeking a Principal Optoelectronic Packaging Engineer to lead in developing next-gen packaging solutions. The role, based at the Samtec Vista Design Center in San Diego, involves mentoring engineers, overseeing architecture development, and ensuring optical module reliability. The position demands 15-25 years of experience and strong communication skills. Competitive salary ranges from $187,000 to $212,000, plus generous bonuses and a comprehensive benefits package. #J-18808-Ljbffr
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