Principal Engineer, Packaging Engineering - Remote | WFH

We are seeking a passionate and innovative Packaging Engineer to join our Packaging R&D team. In this role, you will be responsible for influencing package and product design, focusing on structural integrity, reliability, and advancing semiconductor packaging technologies. Your work will have a direct impact on the future of packaging solutions, specifically in the areas of small form factor packages, thinner chips, denser interconnects, and higher reliability.

Key Responsibilities:

Work on the modeling, simulation, design of experiments, and testing related to semiconductor packaging, flash memory products, and solid-state drives (SSDs).
Address mechanical aspects of packaging technology and the interactions between materials and processes, ensuring solutions meet the growing demands for compact and reliable packaging.
Influence the design and technology of packaging, focusing on structural integrity and reliability.
Interface with cross-functional teams including package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D, and other process teams.
Provide expertise in computational and/or experimental solid mechanics, with a focus on failure analysis and the design of experiments.
Leverage your knowledge of material behaviors, including composites, polymers, metals (e.g., solder), and more to ensure packaging excellence.

Required Qualifications:

Ph.D. in Mechanical Engineering with 3+ years of relevant industry experience, or M.S. in Mechanical Engineering with 5+ years of relevant industrial experience.
Solid knowledge of mechanical engineering principles, with a focus on IC packaging and related areas, gained through academic coursework or professional experience.
Strong background in computational solid mechanics and/or experimental solid mechanics, especially with an emphasis on failure analysis and the design of experiments.
In-depth understanding of mechanical behaviors of various material types, including composite laminates, polymers, and metals (e.g., solder).
Proficiency in conducting mechanical testing and/or using a commercial FEA package.
Solid understanding of semiconductor packaging processes, materials, and trends, including substrate design, molding, wire-bonding, die attach, and flip-chip technologies.

Skills and Abilities:

Excellent oral and written communication skills.
Demonstrated strong work ethic and attention to detail.
Ability to collaborate effectively in a global team environment, interacting with other engineers to define and implement experiments, conduct simulations, and validate new packaging technology.
Ability to develop and propose design solutions that support the development of cutting-edge packaging technologies.

Additional Information:

We are committed to providing equal opportunities to all applicants and employees. We welcome individuals from all backgrounds and are committed to creating an inclusive environment where everyone can thrive. We support applicants with disabilities and provide accommodations as needed throughout the hiring process. If you require any assistance or accommodations during the application process, please feel free to reach out to us.

Compensation & Benefits:

Competitive salary based on qualifications and experience.
Eligibility for short-term and long-term incentive programs.
Comprehensive benefits package, including paid vacation, medical, dental, and vision insurance, life and disability coverage, employee assistance programs, tuition reimbursement, and more.
Access to an employee stock purchase plan and 401(k) plan.

We encourage applicants from all backgrounds to apply and look forward to learning how your skills and experiences will help us drive innovation and deliver solutions for the future.
Employment Type: Full-Time
Salary: $ 111,000.00 264,000.00 Per Year